Inori : La plateforme d’innovation
Description
The patented Pack&Strat® process consists of a 3D digital packaging made from the CAD design of a product or from the 3D scan of an existing part. Above all, it is low-cost packaging with very high reactivity, without tooling costs. It thus allows the rapid automatic design and manufacture of the custom-made 3D counterform from a digital file. It is therefore an innovative process particularly suitable for packaging products with high added value, unique or produced in small series.
All sectors of activity are concerned by the process, and more particularly the automotive, aeronautical, medical, art, design, or even crystal industries.
Extremely modular, the patented Pack&Strat® process perfectly matches the shape of the part and thus offers the best possible protection. It offers the possibility of packing small, medium and large parts of complex shapes but also that of choosing a box with optimized dimensions to pack the product and the wedging, from a database specially configured from industrial standards. .